Copper Clad Aluminum Round Wire

RAYTRON Copper Clad Aluminum Round Wire is manufactured using advanced Clad & Weld process with metallurgical bonding between copper layer and aluminum core, bond strength ≥60MPa, NOT electroplated. Uniform copper layer thickness (10-20%), conductivity up to 65%IACS, density only about 60% of pure copper, significantly reducing transportation and installation costs. Precision drawn and annealed, featuring high surface finish and strict dimensional tolerance (±0.005mm). Suitable for communication cables, coaxial cables, power cables, electronic shielding, and speaker wires. Compliant with international standards including ASTM B566 and GB/T 23309.