Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Clad Aluminum Round Wire
RAYTRON Copper Clad Aluminum Round Wire is manufactured using advanced Clad & Weld process with metallurgical bonding between copper layer and aluminum core, bond strength ≥60MPa, NOT electroplated. Uniform copper layer thickness (10-20%), conductivity up to 65%IACS, density only about 60% of pure copper, significantly reducing transportation and installation costs. Precision drawn and annealed, featuring high surface finish and strict dimensional tolerance (±0.005mm). Suitable for communication cables, coaxial cables, power cables, electronic shielding, and speaker wires. Compliant with international standards including ASTM B566 and GB/T 23309.
Material
Copper Clad Aluminum (Cu/Al)
Conductivity
65% IACS
Tensile Strength
160 MPa
Diameter
0.05mm - 12.0mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Copper Content | 10-20% |
| Density | 3.6-3.8g/cm³ |
| Standards | ASTM B566, GB/T 23309 |
| Temper | Soft, Hard |
Frequently Asked Questions
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