Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Clad Aluminum Strip
Copper Clad Aluminum Strip features excellent conductivity and lightweight properties, suitable for electronic shielding, heat sinks, and battery tabs.
Material
Copper Clad Aluminum (Cu/Al)
Conductivity
65% IACS
Tensile Strength
165 MPa
Diameter
Width: 5mm-1000mm, Thickness: 0.1mm-5mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Copper Content | 10-20% |
| Standards | ASTM B566, GB/T 23309 |
| Temper | Soft, Hard |
| Flatness | ≤0.05mm/m |
Frequently Asked Questions
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Description
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