Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Clad Aluminum Foil
Copper Clad Aluminum Foil features excellent conductivity and lightweight properties, suitable for battery electrodes, capacitors, and electromagnetic shielding in precision electronic applications.
Material
Copper Clad Aluminum (Cu/Al)
Conductivity
65% IACS
Tensile Strength
155 MPa
Diameter
Thickness: 0.01mm-0.1mm, Width: 5mm-1000mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Copper Content | 10-20% |
| Standards | ASTM B566, GB/T 23309 |
| Temper | Soft |
| Surface Roughness | ≤0.2μm |
Frequently Asked Questions
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Description
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