Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Foil
Ultra-thin copper foil suitable for lithium battery anode current collectors, printed circuit boards, electromagnetic shielding and other high-end applications.
Material
Electrolytic Copper (Cu)
Conductivity
101% IACS
Tensile Strength
250 MPa
Diameter
Thickness: 0.006mm - 0.2mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Purity | ≥99.95% |
| Standards | ASTM B568, GB/T 5230 |
| Temper | Soft, Hard |
| Surface Roughness | ≤0.3μm |
Frequently Asked Questions
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Description
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