Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Silver Strip
High quality silver strip with excellent electrical conductivity and workability, suitable for electronic components, connectors, and precision instruments.
Material
High Purity Silver (Ag)
Conductivity
108% IACS
Tensile Strength
180 MPa
Diameter
Width: 1mm - 100mm, Thickness: 0.01mm - 1mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Purity | ≥99.99% |
| Standards | ASTM B187, ISO 9520 |
| Temper | Soft, Hard, Half-Hard |
| Flatness | ≤0.03mm/m |
Frequently Asked Questions
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Description
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