Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Silver Foil
Ultra-thin silver foil with extremely high electrical and thermal conductivity, suitable for high-end electronics, flexible circuits, and medical devices.
Material
High Purity Silver (Ag)
Conductivity
108% IACS
Tensile Strength
200 MPa
Diameter
Thickness: 0.002mm - 0.1mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Purity | ≥99.99% |
| Standards | ASTM B479, ISO 9520 |
| Temper | Soft, Hard |
| Surface Roughness | ≤0.2μm |
Frequently Asked Questions
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