Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Clad Steel Foil
Copper Clad Steel Foil features extremely high tensile strength and good conductivity, suitable for thin electronic shielding applications requiring high mechanical strength.
Material
Copper Clad Steel (Cu/Fe)
Conductivity
30% IACS
Tensile Strength
800 MPa
Diameter
Thickness: 0.01mm-0.1mm, Width: 5mm-500mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Copper Content | 10-30% |
| Standards | ASTM B227, ASTM B452 |
| Temper | Hard |
| Surface Roughness | ≤0.3μm |
Frequently Asked Questions
Related Products
Copper Clad Steel Flat Wire
Copper Clad Steel (Cu/Fe)
Copper Clad Steel Strip
Copper Clad Steel (Cu/Fe)
Copper Clad Steel Ribbon Wire
Copper Clad Steel (Cu/Fe)
Copper Clad Steel Stranded Wire
Copper Clad Steel (Cu/Fe)
Copper Foil
Electrolytic Copper (Cu)
Aluminum Foil
Pure Aluminum (Al)
Title
Description
Image Caption