Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Copper Clad Steel Strip
Copper Clad Steel Strip features extremely high tensile strength and good conductivity, suitable for electronic shielding and connector applications requiring high mechanical strength.
Material
Copper Clad Steel (Cu/Fe)
Conductivity
30% IACS
Tensile Strength
820 MPa
Diameter
Width: 5mm-500mm, Thickness: 0.1mm-5mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Copper Content | 10-30% |
| Standards | ASTM B227, ASTM B452 |
| Temper | Hard |
| Flatness | ≤0.1mm/m |
Frequently Asked Questions
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Description
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