Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Nickel Clad Copper Foil
Nickel Clad Copper Foil features excellent conductivity and corrosion resistance, suitable for battery electrodes, capacitors, and electromagnetic shielding in precision electronic applications.
Material
Nickel Clad Copper (Ni/Cu)
Conductivity
90% IACS
Tensile Strength
370 MPa
Diameter
Thickness: 0.01mm-0.1mm, Width: 5mm-500mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Nickel Content | 5-15% |
| Standards | ASTM B565, AMS 4533 |
| Temper | Soft |
| Surface Roughness | ≤0.2μm |
Frequently Asked Questions
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Description
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