Manufacturing Process

This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.

Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.

Manufacturing Process

This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.

Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.

Nickel Clad Copper Round Wire
nickel-clad-copper

Nickel Clad Copper Round Wire

Nickel Clad Copper Round Wire combines the high conductivity of copper with the excellent corrosion resistance of nickel, suitable for high-temperature environments and marine applications.

Material

Nickel Clad Copper (Ni/Cu)

Conductivity

90% IACS

Tensile Strength

380 MPa

Diameter

0.05mm - 5.0mm

Applications

High-Temperature Environments Marine Engineering Aerospace Electronic Components
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Detailed Specs

Specification Value
Nickel Content 5-15%
Standards ASTM B565, AMS 4533
Temper Soft, Hard
Operating Temperature -200°C to 400°C

Frequently Asked Questions

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