Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
Nickel Clad Copper Strip
Nickel Clad Copper Strip features excellent conductivity and corrosion resistance, suitable for electronic shielding, heat sinks, and connectors in high-temperature applications.
Material
Nickel Clad Copper (Ni/Cu)
Conductivity
90% IACS
Tensile Strength
385 MPa
Diameter
Width: 5mm-500mm, Thickness: 0.1mm-5mm
Applications
Detailed Specs
| Specification | Value |
|---|---|
| Nickel Content | 5-15% |
| Standards | ASTM B565, AMS 4533 |
| Temper | Soft, Hard |
| Flatness | ≤0.05mm/m |
Frequently Asked Questions
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Description
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