Silver Clad Copper (SCC)

High performance Silver Clad Copper for critical electronic applications

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Manufacturing Process

This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.

Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.